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Document type:
Konferenzbeitrag / Conference Paper
Title:
Modeling tool failures in semiconductor fab simulation
Title of conference publication:
Proceedings of the 2004 Winter Simulation Conference (WSC)
Conference title:
Winter Simulation Conference (36., 2004, Washington, DC)
Venue:
Washington, DC,USA
Year of conference:
2004
Date of conference beginning:
05.12.2004
Date of conference ending:
08.12.2004
Publisher:
IEEE
Year:
2004
Pages from - to:
1910-1914
Language:
Englisch
ISBN:
0-7803-8786-4
Open Access yes or no?:
Nein / No
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