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Document type:
Konferenzbeitrag / Conference Paper
Title:
Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption
Title of conference publication:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Conference title:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystem (18., 2017, Dresden)
Venue:
Dresden
Year of conference:
2017
Date of conference beginning:
02.04.2017
Date of conference ending:
05.04.2017
Publishing institution:
IEEE
Year:
2017
Pages from - to:
1-6
Language:
Englisch
ISBN:
978-1-5090-4344-6 ; 978-1-5090-4343-9
Department:
Fakultät für Luft- und Raumfahrttechnik
Institute:
LRT 4 - Institut für Mechanik
Chair:
Lion, Alexander
Open Access yes or no?:
Nein / No
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