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Authors:
Zhang, Bingbing; Lion, Alexander; Johlitz, Michael; Ernst, Leo; Jansen, K. M. B.; Vu, Duc-Khoi; Weiss, Laurens 
Document type:
Konferenzbeitrag / Conference Paper 
Title:
Modelling of thermal aging of Moulding Compound by using an equivalent layer assumption 
Title of conference publication:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 
Conference title:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystem (18., 2017, Dresden) 
Venue:
Dresden 
Year of conference:
2017 
Date of conference beginning:
02.04.2017 
Date of conference ending:
05.04.2017 
Publishing institution:
IEEE 
Year:
2017 
Pages from - to:
1-6 
Language:
Englisch 
ISBN:
978-1-5090-4344-6 ; 978-1-5090-4343-9 
Department:
Fakultät für Luft- und Raumfahrttechnik 
Institute:
LRT 4 - Institut für Mechanik 
Chair:
Lion, Alexander 
Open Access yes or no?:
Nein / No