Gröger, V.; Khatabi, G.; Kotas-Betzwar, A.; Zimprich, P.; Mikulowski, B.; Boczkal, G.; Egger, Werner; Merchant, H. D.; Weiss, B.
Dokumenttyp:
Zeitschriftenartikel / Journal Article
Titel:
Specific defects and thermomechanical properties of electrodeposited Cu foils
Zeitschrift:
Archives of Metallurgy and Materials
Jahrgang:
50
Heftnummer:
1
Konferenztitel:
Symposium on Texture and Microstructure Analysis of Functionally Graded Materials (2004, Cracow)
Konferenztitel:
Symposium on Texture and Microstructure Analysis of Functionally Graded Materials, Cracow, POLAND, OCT 03-07, 2004
Tagungsort:
Cracow
Jahr der Konferenz:
2004
Datum Beginn der Konferenz:
03.07.2004
Jahr:
2005
Seiten von - bis:
167-174
Sprache:
Englisch
Abstract:
Electrodeposition of copper foils is a commercially widely used technique whose potential for producing functionally graded materials by deliberate time variation of the deposition parameters has been shown. Due to the presence of superabundant vacancies (stabilized by hydrogen) structural instabilities are strongly enhanced. More detailed knowledge of microstructural details (especially defect changes during annealing and stability at elevated temperatures) is needed for a basic understanding. Electrical residual resistivity isochrones, positron annihilation, Young's modulus and linear thermal expansion of copper foils of 35 μm thickness of different grain size electrodeposited at commercially usual rates are investigated. For all samples structural changes have been observed during the measurements, the strongest influence seems to be due to the annealing out of single vacancies (presumably by releasing hydrogen) and to grain coarsening. «
Electrodeposition of copper foils is a commercially widely used technique whose potential for producing functionally graded materials by deliberate time variation of the deposition parameters has been shown. Due to the presence of superabundant vacancies (stabilized by hydrogen) structural instabilities are strongly enhanced. More detailed knowledge of microstructural details (especially defect changes during annealing and stability at elevated temperatures) is needed for a basic understanding.... »