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Document type:
Konferenzbeitrag / Conference Paper
Title:
Chip-Level Verification of Complex Mixed-Signal ICs regarding ESD-Stress
Title of conference publication:
5th International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO)
Subtitle of conference publication:
München, 28.-30.11. 2005
Conference title:
International Workshop on Electromagnetic Compatibility of Integrated Circuits (5., 2005, München)
Venue:
München
Year of conference:
2005
Date of conference beginning:
28.11.2005
Date of conference ending:
30.11.2005
Year:
2005
Language:
Englisch
Department:
Fakultät für Elektrotechnik und Technische Informatik
Institute:
ETTI 1 - Institut für Physik, Elektrotechnik und Automatisierungstechnik
Chair:
Groos, Gerhard
Open Access yes or no?:
Nein / No
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