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Document type:
Konferenzbeitrag / Conference Paper
Title:
Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions
Title of conference publication:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Conference title:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (19., 2018, Toulouse)
Venue:
Toulouse, France
Year of conference:
2018
Date of conference beginning:
15.04.2018
Date of conference ending:
18.04.2018
Place of publication:
Piscataway, NJ
Publisher:
IEEE
Year:
2018
Language:
Englisch
ISBN:
978-1-5386-2359-6 ; 978-1-5386-2358-9 ; 978-1-5386-2360-2
Department:
Fakultät für Luft- und Raumfahrttechnik
Institute:
LRT 4 - Institut für Mechanik
Chair:
Lion, Alexander
Open Access yes or no?:
Nein / No
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