Lifetime modeling for a simulative evaluation of package reliability in an automotive application
Veranstalter (Körperschaft):
National Institute for Research and Development in Microtechnologies - IMT Bucharest
Konferenztitel:
International Semiconductor Conference (2017, Sinaia)
Konferenztitel:
International Semiconductor Conference (CAS)
Tagungsort:
Sinaia, Romania
Jahr der Konferenz:
2017
Datum Beginn der Konferenz:
11.10.2017
Datum Ende der Konferenz:
14.10.2017
Jahr:
2017
Seiten von - bis:
201-204
Sprache:
Englisch
Abstract:
A lifetime model based on metamodeling has been combined with a system-level simulation to virtually evaluate the relationship between the application a semiconductor component will be actuated in, its operating and environmental conditions and the package failures. The lifetime model is derived out of accelerated stress tests.