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Document type:
Konferenzbeitrag / Conference Paper
Title:
Simulation of the Cross-Coupling among Snap Back Devices under Transient High Current Stress
Collection editors:
Wachutka, Gerhard; Schrag, Gabriele
Title of conference publication:
Simulation of Semiconductor Processes and Devices 2004
Conference title:
International Conference on Simulation of Semiconductor Processes and Devices (2004, München)
Conference title:
SISPAD 04
Venue:
München
Year of conference:
2004
Date of conference beginning:
02.09.2004
Date of conference ending:
04.09.2004
Place of publication:
Wien
Publisher:
Springer
Year:
2004
Pages from - to:
211-214
Language:
Englisch
ISBN:
978-3-7091-0624-2 ; 978-3-7091-7212-4
Department:
Fakultät für Elektrotechnik und Technische Informatik
Institute:
ETTI 1 - Institut für Physik, Elektrotechnik und Automatisierungstechnik
Chair:
Groos, Gerhard
Open Access yes or no?:
Nein / No
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