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Document type:
Konferenzbeitrag / Conference Paper
Title:
Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP)
Title of conference publication:
28th European Symposium on Reliability of Electronic Devices, Failure Physics and Analysis (ESREF)
Subtitle of conference publication:
Bordeaux, 25.-28.9.2017
Conference title:
European Symposium on Reliability of Electronic Devices, Failure Physics and Analysis (28., 2017, Bordeaux)
Venue:
Bordeaux
Year of conference:
2017
Date of conference beginning:
25.09.2017
Date of conference ending:
28.09.2017
Year:
2017
Language:
Englisch
Department:
Fakultät für Elektrotechnik und Technische Informatik
Institute:
ETTI 1 - Institut für Physik, Elektrotechnik und Automatisierungstechnik
Chair:
Groos, Gerhard
Open Access yes or no?:
Nein / No
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